ELEX Best Paper Award in the year 2023

Integrated circuits

20220558 : LETTER

A 41-GHz 19.4-dBm P_sat CMOS Doherty power amplifier for 5G NR applications

Zheng Li, Zixin Chen, Qiaoyu Wang, Junqing Liu, Jian Pang, Atsushi Shirane, Kenichi Okada

THz devices, circuits and modules

20230395 : LETTER

Low-noise balanced mixer for 300-GHz band based on Fermi-level managed barrier diode on SiC platform

Hiroshi Ito, Yuma Kawamoto, Takahiro Ohara, Tadao Nagatsuma, Tadao Ishibashi

All Best Papers

Vol. 10 No. 23

Electromagnetic theory

20130180 : LETTER

Modelling the inhomogenity of the ferroelectric layer in a multilayered IDC

S. Ramezanpour, S. Nikmehr, L. Ghanbari

Integrated circuits

20130603 : LETTER

A high linear broadband cascode LNA employing common-gate linearity enhancing technology

Zhichao Zhang, Muhammad Khan, Anh Dinh, Li Chen

Electron devices, circuits, and systems

20130701 : LETTER

Area-efficient high-throughput parallel scramblers using generalized algorithms

Yun-Ching Tang, JianWei Chen, Hongchin Lin

Integrated circuits

20130704 : LETTER

A scalable RNS Montgomery multiplier over F_2^m

Jingwei Hu, Wei Guo, Jizeng Wei, Ray C.C. Cheung

Electron devices, circuits, and systems

20130738 : LETTER

Joint-sparse recovery in distributed networks via cooperative support fusion

Zha Song, Huang Jijun, Li Gaosheng, Liu Peiguo

Integrated circuits

20130753 : LETTER

A resistance matching based self-testable current-mode R-2R digital-to-analog converter

Jun Yuan, Masayoshi Tachibana

Integrated circuits

20130756 : LETTER

A simple cost-effective PSR LED driver without auxiliary winding

Weidong Nie, Jin Wu, Zongguang Yu

Electron devices, circuits, and systems

20130772 : LETTER

Fabrication of a magnetic tunnel junction-based 240-tile nonvolatile field-programmable gate array chip skipping wasted write operations for greedy power-reduced logic applications

Daisuke Suzuki, Masanori Natsui, Akira Mochizuki, Sadahiko Miura, Hiroaki Honjo, Keizo Kinoshita, Hideo Sato, Shoji Ikeda, Tetsuo Endoh, Hideo Ohno, Takahiro Hanyu

Integrated circuits

20130800 : LETTER

Dynamic thermal management for 3D multicore processors under process variations

Hyejeong Hong, Jaeil Lim, Hyunyul Lim, Sungho Kang

Electron devices, circuits, and systems

20130807 : LETTER

Loss reduction of lateral power diode on SOI substrate with trenched buried oxide layer

Satoshi Shiraki, Shigeki Takahashi, Youichi Ashida, Atsuyuki Hiruma, Tsuyoshi Funaki

Integrated circuits

20130853 : LETTER

Low power logic BIST with high test effectiveness

Weizheng Wang, Peng Liu, Shuo Cai, Lingyun Xiang

Optoelectronics, Lasers and quantum electronics, Ultrafast optics, Silicon photonics, Planar lightwave circuits

20130871 : LETTER

Proposal of multiple-slot silica high-mesa waveguide for infrared absorption

Jiao Chen, Hirohito Hokazono, Miki Tsujino, Daisuke Nakashima, Kiichi Hamamoto

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IEICE Electronics Express

ELEX Best Paper Award in the year 2023

20220558 : LETTER

A 41-GHz 19.4-dBm P_sat CMOS Doherty power amplifier for 5G NR applications

20230395 : LETTER

Low-noise balanced mixer for 300-GHz band based on Fermi-level managed barrier diode on SiC platform

Archives

Vol. 10 No. 23

20130180 : LETTER

Modelling the inhomogenity of the ferroelectric layer in a multilayered IDC

20130603 : LETTER

A high linear broadband cascode LNA employing common-gate linearity enhancing technology

20130701 : LETTER

Area-efficient high-throughput parallel scramblers using generalized algorithms

20130704 : LETTER

A scalable RNS Montgomery multiplier over F_2^m

20130738 : LETTER

Joint-sparse recovery in distributed networks via cooperative support fusion

20130753 : LETTER

A resistance matching based self-testable current-mode R-2R digital-to-analog converter

20130756 : LETTER

A simple cost-effective PSR LED driver without auxiliary winding

20130772 : LETTER

Fabrication of a magnetic tunnel junction-based 240-tile nonvolatile field-programmable gate array chip skipping wasted write operations for greedy power-reduced logic applications

20130800 : LETTER

Dynamic thermal management for 3D multicore processors under process variations

20130807 : LETTER

Loss reduction of lateral power diode on SOI substrate with trenched buried oxide layer

20130853 : LETTER

Low power logic BIST with high test effectiveness

20130871 : LETTER

Proposal of multiple-slot silica high-mesa waveguide for infrared absorption