| 大会名称 |
| 2019年 総合大会 |
| 大会コ－ド |
| 2019G |
| 開催年 |
|
2019
|
| 発行日 |
|
2019-03-05
|
| セッション番号 |
|
CK-3
|
| セッション名 |
|
Thailand-Japan Microwave (TJMW) 2018 優秀発表賞特別セッション
|
| 講演日 |
|
2019/03/21
|
| 講演場所(会議室等) |
|
53号館 401教室
|
| 講演番号 |
|
CK-3-3
|
| タイトル |
|
Complementary Split Ring Resonator Embedded on H-Plane Split Waveguide for Thin Photoresist Film Thickness Characterization
|
| 著者名 |
|
○Nonchanutt Chudpooti, Prayoot Akkaraekthalin, Nutapong Somjit,
|
| キーワード |
|
Non-Destructive Measurement, Millimeter-Wave Sensor, SU-8 Photoresist, Thickness characterization
|
| 抄録 |
|
Non-destructive thickness measurement offers a valuable feature for thin polymer-based applications in both industrial and medical utilization. Herein, we developed a novel, non-destructive, millimeter-wave WR-10 waveguide sensor for measuring a dielectric film layer on a transparent substrate. Complementary split-ring resonator (CSRR) was integrated on top of a customized WR10 waveguide and operated at 96 GHz. The thickness of the SU-8 layers, ranging from 3-13 μm, coated on a glass substrate was then examined using the resonant frequency shift. The thickness values obtained from this novel sensor strongly resemble the values obtained from standard surface profiler measurement method, with less than 5 % difference. Thus, our novel design offers a comparable accuracy with a better cost effectiveness when compare with an existing commercial instrument.
|
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|
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