2009 International Symposium on Electromagnetic Compatibility, Kyoto

number title/author
23Q1-1EMC Modeling of an Intel Dual Die CPU
B. Zhu,
23Q1-2Behavioural Model of Integrated Circuits for EMC Prediction
F. Fiori,
23Q1-3A Concurrent Engineering Platform for Modeling IC Emission and Immunity
A. C. Ndoye, A. Boyer, E. Sicard, S. Serpaud, F. Lafon,
23Q1-4A CMOS Opamp Immune to EMI with no Penalty in Baseband Operation
P. S. Crovetti,