Summary
International Symposium on Electromagnetic Compatibility
2009
Session Number:23Q1
Session:
Number:23Q1-2
Behavioural Model of Integrated Circuits for EMC Prediction
F. Fiori,
pp.525-528
Publication Date:2009/7/20
Online ISSN:2188-5079
Summary:
This paper deals with the modeling of integrated circuits for electromagnetic compatibility (EMC) analysis. With reference to complex integrated circuits that usually include huge core logic blocks, analog and mixed signal circuits as well as power sections (smart-power system-on-chip), the paper shows a new behavioral model whose parameters can be derived on the basis of scattering parameters and switching noise measurements. Through this new model, the electromagnetic emissions arising from such system-on-chip in application boards can be evaluated and mitigated before fabrication.