Summary
International Symposium on Electromagnetic Compatibility
2009
Session Number:23Q1
Session:
Number:23Q1-1
EMC Modeling of an Intel Dual Die CPU
B. Zhu,
pp.521-524
Publication Date:2009/7/20
Online ISSN:2188-5079
Summary:
With the continuous increment in the requirement of chip performance, multiple dies integrated in a single package have become an effective and efficient way. However, under such high integration, it is found that electromagnetic interference generated turns to be a critical potential problem in further application environment. This paper presents an electromagnetic study with Intel Pentium Dual Die CPU model which is modelled as a patch antenna model with high radiation frequency relating to the industrial, scientific and medical (ISM) radio bands (2.45GHz and 5.80GHz). The model geometry is extracted from the data sheet of existing chip with some approximations. Various comparisons are studied under different situations of mounted heatsink and die distance, by means of FEM in frequency domain.