Electronics-Integrated Circuits and Devices(Date:1994/11/25)

Presentation
表紙

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[Date]1994/11/25
[Paper #]
目次

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[Date]1994/11/25
[Paper #]
Electrical characterization of package inductance and simultaneous swithing noise for leadframe packages.

Masayuki Miura,  Naohiko Hirano,  Yoichi Hiruta,  Toshio Sudo,  

[Date]1994/11/25
[Paper #]ICD94-147
Fluxless soldering technology

Toru Nishikawa,  Masahiro Ijuin,  Ryohei Satoh,  Yasuhiro Iwata,  Mitsunori Tamura,  Mitsugu Shirai,  

[Date]1994/11/25
[Paper #]ICD94-148
Development of PPF(Pre-Plated-Frame)Package Process

Tomoshi Kimura,  Yasuhisa Yamaji,  Koji Miyata,  Kazumasa Aoki,  Atsuya Narai,  Toshiya Ishio,  Kazuya Fujita,  Morihiro Kada,  

[Date]1994/11/25
[Paper #]ICD94-149
Development and Application of Piezoresistance Stress Sensor

Kikuko Sugimae,  Tsutomu Nakazawa,  Kanako Sawada,  Toshio Sudo,  Morihiko Ikemizu,  Hiroyuki Kozono,  Sigeki Sakoh,  Hiromichi Sawaya,  

[Date]1994/11/25
[Paper #]ICD94-150
Development of Molding Compounds Suited for Copper Leadframes

Takashi Aihara,  Hiroshi Suzuki,  Hironori Ohsuga,  Takanobu Hamano,  

[Date]1994/11/25
[Paper #]ICD94-151
Required characteristics of die bond materials to improve the popcorn resistance of plastics surface mounted devices

Masahiko Yukawa,  Tohru Terasaki,  Tomoshi Ohde,  

[Date]1994/11/25
[Paper #]ICD94-152
Analysis of Package Cracking During Reflow Soldering Process : Elucidation of Delamination and Reduction of Stress by Thin Package

Tsutomu Nakazawa,  Yumi Inoue,  Kanako Sawada,  Toshio Sudo,  

[Date]1994/11/25
[Paper #]ICD94-153
Development of 0.45mm Thick Ultra-Thin Small Outline Package(UTSOP)

Koji Miyata,  Tomoyo Maruyama,  Yoshikazu Ohara,  Toshiya Ishio,  Atsuya Narai,  Yoshiki Sota,  Kenji Toyosawa,  Kazuya Fujita,  Morihiro Kada,  

[Date]1994/11/25
[Paper #]ICD94-154
Reflow Crack Resistance of Ultra-thin Small Outline Package(UTSOP)

Toshiya Ishio,  Tomoyo Maruyama,  Koji Miyata,  Atsuya Narai,  Yoshiki Sota,  Kenji Toyosawa,  Kazuya Fujita,  Morihiro Kada,  

[Date]1994/11/25
[Paper #]ICD94-155
Analysis of Package Cracking During Reflow Soldering Process- Quantification and Improvement of Adhesion Strength of Interface-

Yumi Inoue,  Tsutomu Nakazawa,  Kanako Sawada,  Toshio Sudo,  

[Date]1994/11/25
[Paper #]ICD94-156
Development of a Tapeless Lead-On-Chip (LOC) Package

Masazumi Amagai,  Robert Baumann,  Eiji Kawasaki,  

[Date]1994/11/25
[Paper #]ICD94-157
Development of a tapeless lead-on-chip (LOC) package

Takurou Asazu,  Naoyuki Tajima,  Katsunobu Mori,  Yasunori Chikawa,  Morihiro Kada,  

[Date]1994/11/25
[Paper #]ICD94-158
The development of surface mount technology for fine pitch package

Kuniaki Takahashi,  Sadao Makita,  Kanji Inoue,  Youichirou Maehara,  Terumi Nakahara,  Minoru Mukai,  

[Date]1994/11/25
[Paper #]ICD94-159
[OTHERS]

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[Date]1994/11/25
[Paper #]