| Presentation | 1994/11/25 Analysis of Package Cracking During Reflow Soldering Process- Quantification and Improvement of Adhesion Strength of Interface- Yumi Inoue, Tsutomu Nakazawa, Kanako Sawada, Toshio Sudo, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The most important factor of cracking phenomenon during reflow soldering processes is the delamination of the interface in the packages.Because the adhesion strengths at the interface between the metal die-pad and resin drop rapidly for high temperature and humidity,it is difficult to maintain adhesion and prevent package cracking. So,the fundamental estimation was made for the strength at the interface by quantifying the adhesion strength of the interfaces between resin and polyimide,silicon and alloy-42 by varying the temperature and humidity. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Plastic / Package / Cracking / Interface / Adhesion |
| Paper # | ICD94-156 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Analysis of Package Cracking During Reflow Soldering Process- Quantification and Improvement of Adhesion Strength of Interface- |
| Sub Title (in English) | |
| Keyword(1) | Plastic |
| Keyword(2) | Package |
| Keyword(3) | Cracking |
| Keyword(4) | Interface |
| Keyword(5) | Adhesion |
| 1st Author's Name | Yumi Inoue |
| 1st Author's Affiliation | Semiconductor Device Engineering,Laboratory,Toshiba Corporation() |
| 2nd Author's Name | Tsutomu Nakazawa |
| 2nd Author's Affiliation | Semiconductor Device Engineering,Laboratory,Toshiba Corporation |
| 3rd Author's Name | Kanako Sawada |
| 3rd Author's Affiliation | Semiconductor Device Engineering,Laboratory,Toshiba Corporation |
| 4th Author's Name | Toshio Sudo |
| 4th Author's Affiliation | Semiconductor Device Engineering,Laboratory,Toshiba Corporation |
| Date | 1994/11/25 |
| Paper # | ICD94-156 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |