Presentation 1994/11/25
Development of Molding Compounds Suited for Copper Leadframes
Takashi Aihara, Hiroshi Suzuki, Hironori Ohsuga, Takanobu Hamano,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) With a recent trend toward surface mounting of semi-conductor devices,package styles are coming to have higher pin-counts had be smaller and thinner.The most serious questions concerning surface mount packages are cracking due to thermal stress in mounting process and the deterioration of humidity resistance caused by it. On the other hand,leadframe materials are changing.Iron alloys have been mainry used as leadframe materials,but recentry copper alloys have become very popular.Therfore we conducted various studies on molding compounds for surface mount packages suitable for copper alloy leadframes.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) molding compound / copper alloy leadframe / solder crack resistance / temperature cycle performance / adhesion strength / thermal stress
Paper # ICD94-151
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Conference Information
Committee ICD
Conference Date 1994/11/25(1days)
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Paper Information
Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of Molding Compounds Suited for Copper Leadframes
Sub Title (in English)
Keyword(1) molding compound
Keyword(2) copper alloy leadframe
Keyword(3) solder crack resistance
Keyword(4) temperature cycle performance
Keyword(5) adhesion strength
Keyword(6) thermal stress
1st Author's Name Takashi Aihara
1st Author's Affiliation Sumitomo Bakelite()
2nd Author's Name Hiroshi Suzuki
2nd Author's Affiliation Sumitomo Bakelite
3rd Author's Name Hironori Ohsuga
3rd Author's Affiliation Sumitomo Bakelite
4th Author's Name Takanobu Hamano
4th Author's Affiliation Sumitomo Bakelite
Date 1994/11/25
Paper # ICD94-151
Volume (vol) vol.94
Number (no) 361
Page pp.pp.-
#Pages 8
Date of Issue