| Presentation | 1994/11/25 Development of Molding Compounds Suited for Copper Leadframes Takashi Aihara, Hiroshi Suzuki, Hironori Ohsuga, Takanobu Hamano, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | With a recent trend toward surface mounting of semi-conductor devices,package styles are coming to have higher pin-counts had be smaller and thinner.The most serious questions concerning surface mount packages are cracking due to thermal stress in mounting process and the deterioration of humidity resistance caused by it. On the other hand,leadframe materials are changing.Iron alloys have been mainry used as leadframe materials,but recentry copper alloys have become very popular.Therfore we conducted various studies on molding compounds for surface mount packages suitable for copper alloy leadframes. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | molding compound / copper alloy leadframe / solder crack resistance / temperature cycle performance / adhesion strength / thermal stress |
| Paper # | ICD94-151 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of Molding Compounds Suited for Copper Leadframes |
| Sub Title (in English) | |
| Keyword(1) | molding compound |
| Keyword(2) | copper alloy leadframe |
| Keyword(3) | solder crack resistance |
| Keyword(4) | temperature cycle performance |
| Keyword(5) | adhesion strength |
| Keyword(6) | thermal stress |
| 1st Author's Name | Takashi Aihara |
| 1st Author's Affiliation | Sumitomo Bakelite() |
| 2nd Author's Name | Hiroshi Suzuki |
| 2nd Author's Affiliation | Sumitomo Bakelite |
| 3rd Author's Name | Hironori Ohsuga |
| 3rd Author's Affiliation | Sumitomo Bakelite |
| 4th Author's Name | Takanobu Hamano |
| 4th Author's Affiliation | Sumitomo Bakelite |
| Date | 1994/11/25 |
| Paper # | ICD94-151 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |