| Presentation | 1994/11/25 Development of PPF(Pre-Plated-Frame)Package Process Tomoshi Kimura, Yasuhisa Yamaji, Koji Miyata, Kazumasa Aoki, Atsuya Narai, Toshiya Ishio, Kazuya Fujita, Morihiro Kada, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In plastic package assembly process,solder plating for outer- lead has been made by subcontractors,at the end of assembly process.But this has prevented the TAT(turnaround time)from being reduced and the process from being converted to an inline arrangement.A solder PPF(Pre-Plated-Frame)package process including highspeed plating and lower-temperature assembly process has been developed to resolve these problems.In addition, foundation plating specification have been rationalized to remove the solder PPF specific problem of solder deformation during resin molding,thereby offering productivity and reliability equivalent or even superior to the conventional process. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Plastic Package / Solder PPF / Solder Deformation / Lead Frame |
| Paper # | ICD94-149 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of PPF(Pre-Plated-Frame)Package Process |
| Sub Title (in English) | |
| Keyword(1) | Plastic Package |
| Keyword(2) | Solder PPF |
| Keyword(3) | Solder Deformation |
| Keyword(4) | Lead Frame |
| 1st Author's Name | Tomoshi Kimura |
| 1st Author's Affiliation | Integrated Circuits Group,Sharp() |
| 2nd Author's Name | Yasuhisa Yamaji |
| 2nd Author's Affiliation | Integrated Circuits Group,Sharp |
| 3rd Author's Name | Koji Miyata |
| 3rd Author's Affiliation | Integrated Circuits Group,Sharp |
| 4th Author's Name | Kazumasa Aoki |
| 4th Author's Affiliation | Integrated Circuits Group,Sharp |
| 5th Author's Name | Atsuya Narai |
| 5th Author's Affiliation | Integrated Circuits Group,Sharp |
| 6th Author's Name | Toshiya Ishio |
| 6th Author's Affiliation | Integrated Circuits Group,Sharp |
| 7th Author's Name | Kazuya Fujita |
| 7th Author's Affiliation | Integrated Circuits Group,Sharp |
| 8th Author's Name | Morihiro Kada |
| 8th Author's Affiliation | Integrated Circuits Group,Sharp |
| Date | 1994/11/25 |
| Paper # | ICD94-149 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |