Presentation 1994/11/25
Development of PPF(Pre-Plated-Frame)Package Process
Tomoshi Kimura, Yasuhisa Yamaji, Koji Miyata, Kazumasa Aoki, Atsuya Narai, Toshiya Ishio, Kazuya Fujita, Morihiro Kada,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) In plastic package assembly process,solder plating for outer- lead has been made by subcontractors,at the end of assembly process.But this has prevented the TAT(turnaround time)from being reduced and the process from being converted to an inline arrangement.A solder PPF(Pre-Plated-Frame)package process including highspeed plating and lower-temperature assembly process has been developed to resolve these problems.In addition, foundation plating specification have been rationalized to remove the solder PPF specific problem of solder deformation during resin molding,thereby offering productivity and reliability equivalent or even superior to the conventional process.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Plastic Package / Solder PPF / Solder Deformation / Lead Frame
Paper # ICD94-149
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Conference Date 1994/11/25(1days)
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Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of PPF(Pre-Plated-Frame)Package Process
Sub Title (in English)
Keyword(1) Plastic Package
Keyword(2) Solder PPF
Keyword(3) Solder Deformation
Keyword(4) Lead Frame
1st Author's Name Tomoshi Kimura
1st Author's Affiliation Integrated Circuits Group,Sharp()
2nd Author's Name Yasuhisa Yamaji
2nd Author's Affiliation Integrated Circuits Group,Sharp
3rd Author's Name Koji Miyata
3rd Author's Affiliation Integrated Circuits Group,Sharp
4th Author's Name Kazumasa Aoki
4th Author's Affiliation Integrated Circuits Group,Sharp
5th Author's Name Atsuya Narai
5th Author's Affiliation Integrated Circuits Group,Sharp
6th Author's Name Toshiya Ishio
6th Author's Affiliation Integrated Circuits Group,Sharp
7th Author's Name Kazuya Fujita
7th Author's Affiliation Integrated Circuits Group,Sharp
8th Author's Name Morihiro Kada
8th Author's Affiliation Integrated Circuits Group,Sharp
Date 1994/11/25
Paper # ICD94-149
Volume (vol) vol.94
Number (no) 361
Page pp.pp.-
#Pages 8
Date of Issue