| Presentation | 1994/11/25 Reflow Crack Resistance of Ultra-thin Small Outline Package(UTSOP) Toshiya Ishio, Tomoyo Maruyama, Koji Miyata, Atsuya Narai, Yoshiki Sota, Kenji Toyosawa, Kazuya Fujita, Morihiro Kada, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A UTSOP with a thickness less than a half (0.45mm) that of a conventional TSOP has been developed.In order to maintain installation workability equivalent to that of a conventional TSOP, experiments directed toward improving reflow crack resistance were conducted. Reflow crack resistance was significantly improved by optimizing the physical properties of the thermoplastic die bond tape,its sticking position,and die bonding conditions. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | UTSOP / Adhesive Tape / Package Crack |
| Paper # | ICD94-155 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Reflow Crack Resistance of Ultra-thin Small Outline Package(UTSOP) |
| Sub Title (in English) | |
| Keyword(1) | UTSOP |
| Keyword(2) | Adhesive Tape |
| Keyword(3) | Package Crack |
| 1st Author's Name | Toshiya Ishio |
| 1st Author's Affiliation | Integrated Circuits Group,Sharp() |
| 2nd Author's Name | Tomoyo Maruyama |
| 2nd Author's Affiliation | Integrated Circuits Group,Sharp |
| 3rd Author's Name | Koji Miyata |
| 3rd Author's Affiliation | Integrated Circuits Group,Sharp |
| 4th Author's Name | Atsuya Narai |
| 4th Author's Affiliation | Integrated Circuits Group,Sharp |
| 5th Author's Name | Yoshiki Sota |
| 5th Author's Affiliation | Integrated Circuits Group,Sharp |
| 6th Author's Name | Kenji Toyosawa |
| 6th Author's Affiliation | Integrated Circuits Group,Sharp |
| 7th Author's Name | Kazuya Fujita |
| 7th Author's Affiliation | Integrated Circuits Group,Sharp |
| 8th Author's Name | Morihiro Kada |
| 8th Author's Affiliation | Integrated Circuits Group,Sharp |
| Date | 1994/11/25 |
| Paper # | ICD94-155 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |