| Presentation | 1994/11/25 Required characteristics of die bond materials to improve the popcorn resistance of plastics surface mounted devices Masahiko Yukawa, Tohru Terasaki, Tomoshi Ohde, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We investigated the way to prevent the popcorn phenomena from viewpoint of the characteristics of die bond paste,die pad structue and mold resin.Ag paste characteristics remarkably influence on the anti-cracking performance of plastics package consist of biphenyl type mold resin and 42 alloy.Copper lead frame is remarkably difficult to improve,but we can find out that new film type die bond materials,with characteristics of higher adhesion and lower moisture adsorption,will be able to improve the popcorn resistance. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | package crack / die bond material / adhesion / solubility coefficient / Cu lead frame |
| Paper # | ICD94-152 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Required characteristics of die bond materials to improve the popcorn resistance of plastics surface mounted devices |
| Sub Title (in English) | |
| Keyword(1) | package crack |
| Keyword(2) | die bond material |
| Keyword(3) | adhesion |
| Keyword(4) | solubility coefficient |
| Keyword(5) | Cu lead frame |
| 1st Author's Name | Masahiko Yukawa |
| 1st Author's Affiliation | Semiconductor Company,Sony Corporation() |
| 2nd Author's Name | Tohru Terasaki |
| 2nd Author's Affiliation | Semiconductor Company,Sony Corporation |
| 3rd Author's Name | Tomoshi Ohde |
| 3rd Author's Affiliation | Semiconductor Company,Sony Corporation |
| Date | 1994/11/25 |
| Paper # | ICD94-152 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |