| Presentation | 1994/11/25 Analysis of Package Cracking During Reflow Soldering Process : Elucidation of Delamination and Reduction of Stress by Thin Package Tsutomu Nakazawa, Yumi Inoue, Kanako Sawada, Toshio Sudo, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A suppression of delamination at the interface is required in a plastic package of semiconductor devices in order to get rid of the moisture proof packing.However,the adhesion improvement at the interface between the die-pad and the resin is not expected for the conventional plastic packages,because the adhesion strength at the interface decreases by the moisture absorption and at high temperature.In the meanwhile,the package cracking resistance during reflow soldering can be improved for the thinner packages. Therefore,non-cracking packages can be realized by eliminating the die-pad,coating polyimide and thinning package.This paper elucidates the delamination phenomenon at the interface and propose a new approach to realize the non-cracking package. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | package / crack / delamination / interface / polyimide / stress |
| Paper # | ICD94-153 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Analysis of Package Cracking During Reflow Soldering Process : Elucidation of Delamination and Reduction of Stress by Thin Package |
| Sub Title (in English) | |
| Keyword(1) | package |
| Keyword(2) | crack |
| Keyword(3) | delamination |
| Keyword(4) | interface |
| Keyword(5) | polyimide |
| Keyword(6) | stress |
| 1st Author's Name | Tsutomu Nakazawa |
| 1st Author's Affiliation | Semiconductor Device Engineering,Laboratory,Toshiba Corporation() |
| 2nd Author's Name | Yumi Inoue |
| 2nd Author's Affiliation | Semiconductor Device Engineering,Laboratory,Toshiba Corporation |
| 3rd Author's Name | Kanako Sawada |
| 3rd Author's Affiliation | Semiconductor Device Engineering,Laboratory,Toshiba Corporation |
| 4th Author's Name | Toshio Sudo |
| 4th Author's Affiliation | Semiconductor Device Engineering,Laboratory,Toshiba Corporation |
| Date | 1994/11/25 |
| Paper # | ICD94-153 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |