| Presentation | 1994/11/25 Electrical characterization of package inductance and simultaneous swithing noise for leadframe packages. Masayuki Miura, Naohiko Hirano, Yoichi Hiruta, Toshio Sudo, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Plastic molded packages with alloy 42,or copper(Cu)leadframes are widely used for commercial applications.The alloy 42 leadframes are thought to be unsuited for high speed CMOS applications,because the package self-inductance may cause a large amount of simultaneous switching noise(SSN)due to the high permeability of ferromagnetics. This paper reports frequency characteristics of lead inductances and resistances for three types of leadframe packages made of Cu, alloy 42,Ag-plating alloy 42.Then,SSN for them were measured using CMOS test device.Furthermore,package design guide for the power, ground connection was obtained to meet acceptable noise level. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | package / leadframe / inductance / simultaneous switching noise |
| Paper # | ICD94-147 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Electrical characterization of package inductance and simultaneous swithing noise for leadframe packages. |
| Sub Title (in English) | |
| Keyword(1) | package |
| Keyword(2) | leadframe |
| Keyword(3) | inductance |
| Keyword(4) | simultaneous switching noise |
| 1st Author's Name | Masayuki Miura |
| 1st Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation() |
| 2nd Author's Name | Naohiko Hirano |
| 2nd Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation |
| 3rd Author's Name | Yoichi Hiruta |
| 3rd Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation |
| 4th Author's Name | Toshio Sudo |
| 4th Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation |
| Date | 1994/11/25 |
| Paper # | ICD94-147 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |