| Presentation | 1994/11/25 The development of surface mount technology for fine pitch package Kuniaki Takahashi, Sadao Makita, Kanji Inoue, Youichirou Maehara, Terumi Nakahara, Minoru Mukai, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | We have evaluated three kinds of package (0.3mmpitch QFP,0. 25mmpitch TCP,1.5mmpitch PBGA) for SMT in order to the development of compact and portable mobile computers in future.QFP is easy for mounting in small number of pin,however there are two problems of high pin count.The first one,is that QFP can't become low profile. The second one is high defects rate of SMT.TCP is low profile and good for heat radiation,but TCP needs OLB (machine for the exclusive use of TCP)and cycle time is long.BGA is easy for SMT, but it is inefficient in inspection and repairing.BGA have not low profile and the good heat radiation. TCP has high pin count,low profile and good heat radiation, therefore we have selected TCP. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | quad flat package / tape carrier package / ball grid array / surface mount technology / high pin count / solder joint |
| Paper # | ICD94-159 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | The development of surface mount technology for fine pitch package |
| Sub Title (in English) | |
| Keyword(1) | quad flat package |
| Keyword(2) | tape carrier package |
| Keyword(3) | ball grid array |
| Keyword(4) | surface mount technology |
| Keyword(5) | high pin count |
| Keyword(6) | solder joint |
| 1st Author's Name | Kuniaki Takahashi |
| 1st Author's Affiliation | Ome Works,Toshiba Corporation() |
| 2nd Author's Name | Sadao Makita |
| 2nd Author's Affiliation | Ome Works,Toshiba Corporation |
| 3rd Author's Name | Kanji Inoue |
| 3rd Author's Affiliation | Ome Works,Toshiba Corporation |
| 4th Author's Name | Youichirou Maehara |
| 4th Author's Affiliation | Manufacturing Engineering Research Center,Toshiba Corporation |
| 5th Author's Name | Terumi Nakahara |
| 5th Author's Affiliation | Manufacturing Engineering Research Center,Toshiba Corporation |
| 6th Author's Name | Minoru Mukai |
| 6th Author's Affiliation | R&D Center,Toshiba Corporation |
| Date | 1994/11/25 |
| Paper # | ICD94-159 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |