Presentation 1994/11/25
The development of surface mount technology for fine pitch package
Kuniaki Takahashi, Sadao Makita, Kanji Inoue, Youichirou Maehara, Terumi Nakahara, Minoru Mukai,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have evaluated three kinds of package (0.3mmpitch QFP,0. 25mmpitch TCP,1.5mmpitch PBGA) for SMT in order to the development of compact and portable mobile computers in future.QFP is easy for mounting in small number of pin,however there are two problems of high pin count.The first one,is that QFP can't become low profile. The second one is high defects rate of SMT.TCP is low profile and good for heat radiation,but TCP needs OLB (machine for the exclusive use of TCP)and cycle time is long.BGA is easy for SMT, but it is inefficient in inspection and repairing.BGA have not low profile and the good heat radiation. TCP has high pin count,low profile and good heat radiation, therefore we have selected TCP.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) quad flat package / tape carrier package / ball grid array / surface mount technology / high pin count / solder joint
Paper # ICD94-159
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Conference Date 1994/11/25(1days)
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Paper Information
Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) The development of surface mount technology for fine pitch package
Sub Title (in English)
Keyword(1) quad flat package
Keyword(2) tape carrier package
Keyword(3) ball grid array
Keyword(4) surface mount technology
Keyword(5) high pin count
Keyword(6) solder joint
1st Author's Name Kuniaki Takahashi
1st Author's Affiliation Ome Works,Toshiba Corporation()
2nd Author's Name Sadao Makita
2nd Author's Affiliation Ome Works,Toshiba Corporation
3rd Author's Name Kanji Inoue
3rd Author's Affiliation Ome Works,Toshiba Corporation
4th Author's Name Youichirou Maehara
4th Author's Affiliation Manufacturing Engineering Research Center,Toshiba Corporation
5th Author's Name Terumi Nakahara
5th Author's Affiliation Manufacturing Engineering Research Center,Toshiba Corporation
6th Author's Name Minoru Mukai
6th Author's Affiliation R&D Center,Toshiba Corporation
Date 1994/11/25
Paper # ICD94-159
Volume (vol) vol.94
Number (no) 361
Page pp.pp.-
#Pages 8
Date of Issue