| Presentation | 1994/11/25 Development of a Tapeless Lead-On-Chip (LOC) Package Masazumi Amagai, Robert Baumann, Eiji Kawasaki, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | A double-sided tape is typically used as an insulator and mechanical buffer layer between the chip and lead frame in lead-on- chip(LOC)packages.The costs associated with the lead frame and tape process make the current LOC package ten times more expensive than conventional packaging.A new tapeless LOC package process has been developed which significantly reduces the production costs.In this new process,the tape is replaced by a thermoplastic adhesive layer deposited on the polyimide coated wafer.This paper describes the optimum thermoplastic material properties for the adhesive layer,the fabrication process parameters,and experimental and simulated reliability and performance results of the tapeless LOC package. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Tapeless LOC / Adhesive / Alpha particle / Thermoplastic polyimide / Mechanical stress / Package capacitance |
| Paper # | ICD94-157 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | ENG |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of a Tapeless Lead-On-Chip (LOC) Package |
| Sub Title (in English) | |
| Keyword(1) | Tapeless LOC |
| Keyword(2) | Adhesive |
| Keyword(3) | Alpha particle |
| Keyword(4) | Thermoplastic polyimide |
| Keyword(5) | Mechanical stress |
| Keyword(6) | Package capacitance |
| 1st Author's Name | Masazumi Amagai |
| 1st Author's Affiliation | Department of New Package Development Hiji Plant Texas Instruments Japan() |
| 2nd Author's Name | Robert Baumann |
| 2nd Author's Affiliation | Department of ULSI Technology Development Miho Plant Texas Instruments Japan |
| 3rd Author's Name | Eiji Kawasaki |
| 3rd Author's Affiliation | Department of Wafer Fabrication Engineering Miho Plant Texas Instruments Japan |
| Date | 1994/11/25 |
| Paper # | ICD94-157 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |