| Presentation | 1994/11/25 Development of 0.45mm Thick Ultra-Thin Small Outline Package(UTSOP) Koji Miyata, Tomoyo Maruyama, Yoshikazu Ohara, Toshiya Ishio, Atsuya Narai, Yoshiki Sota, Kenji Toyosawa, Kazuya Fujita, Morihiro Kada, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | The authors developed an Ultra-Thin Small Outline Package (UTSOP) with a package thickness of 0.45mm. In spite that it is a significant reduction relative to conventional TSOPs(1.0mm thick),the inner leads of the lead frame can be bonded to the electrodes on the chip with gold wire as with conventional plastic package. It is feasible since the lead thatsupports the chip through insulating tape (support lead) is placed on the top side ofthe chip. Establishing molding technology and overcoming problems such as warping of package or chip during assembly were key points in the development of the UTSOP. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | 0.45mm thick UTSOP / SLOC construction / holding the chip / invar material |
| Paper # | ICD94-154 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
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| Conference Date | 1994/11/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Development of 0.45mm Thick Ultra-Thin Small Outline Package(UTSOP) |
| Sub Title (in English) | |
| Keyword(1) | 0.45mm thick UTSOP |
| Keyword(2) | SLOC construction |
| Keyword(3) | holding the chip |
| Keyword(4) | invar material |
| 1st Author's Name | Koji Miyata |
| 1st Author's Affiliation | Integrated Circuits Group,SHARP() |
| 2nd Author's Name | Tomoyo Maruyama |
| 2nd Author's Affiliation | Integrated Circuits Group,SHARP |
| 3rd Author's Name | Yoshikazu Ohara |
| 3rd Author's Affiliation | Integrated Circuits Group,SHARP |
| 4th Author's Name | Toshiya Ishio |
| 4th Author's Affiliation | Integrated Circuits Group,SHARP |
| 5th Author's Name | Atsuya Narai |
| 5th Author's Affiliation | Integrated Circuits Group,SHARP |
| 6th Author's Name | Yoshiki Sota |
| 6th Author's Affiliation | Integrated Circuits Group,SHARP |
| 7th Author's Name | Kenji Toyosawa |
| 7th Author's Affiliation | Integrated Circuits Group,SHARP |
| 8th Author's Name | Kazuya Fujita |
| 8th Author's Affiliation | Integrated Circuits Group,SHARP |
| 9th Author's Name | Morihiro Kada |
| 9th Author's Affiliation | Integrated Circuits Group,SHARP |
| Date | 1994/11/25 |
| Paper # | ICD94-154 |
| Volume (vol) | vol.94 |
| Number (no) | 361 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |