Presentation 1994/11/25
Development of a tapeless lead-on-chip (LOC) package
Takurou Asazu, Naoyuki Tajima, Katsunobu Mori, Yasunori Chikawa, Morihiro Kada,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) A TCP used for an LCD driver has been developed.The pitches are 70μm for inner lead,75μm for connection and 60μm for minimum wir ing.300 of 18μm straight wall bumps are formed on SST type chips w hich aspect ratio is 1:8.The inner leads are processed in ganging bond.the tape carrier has 1, 2 oz E.D.and a newly created resin is utilized.Cumulative accuracy for the leads are controlled by better mamagement watching the storage environment.Some finer etchingis aiso applied to make a sectional shape of the connections.Flexible TCPs with 240 outputs arebeing produced for STN color panels with the process.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) fine pitch / flexible TCP / mount area / dimension change
Paper # ICD94-158
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Committee ICD
Conference Date 1994/11/25(1days)
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Paper Information
Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of a tapeless lead-on-chip (LOC) package
Sub Title (in English)
Keyword(1) fine pitch
Keyword(2) flexible TCP
Keyword(3) mount area
Keyword(4) dimension change
1st Author's Name Takurou Asazu
1st Author's Affiliation SHARP()
2nd Author's Name Naoyuki Tajima
2nd Author's Affiliation SHARP
3rd Author's Name Katsunobu Mori
3rd Author's Affiliation SHARP
4th Author's Name Yasunori Chikawa
4th Author's Affiliation SHARP
5th Author's Name Morihiro Kada
5th Author's Affiliation SHARP
Date 1994/11/25
Paper # ICD94-158
Volume (vol) vol.94
Number (no) 361
Page pp.pp.-
#Pages 8
Date of Issue