number | title/author |
---|---|
23Q2-1 | Broadband Reduction of Swiching Noise by Embedding High-Density Thin-Film Capacitor in a Laminated Package S. Kaneko, Y. Takahashi, T. Sudo, A. Kanno, |
23Q2-2 | Examination of Power-Ground Resonance for IBIS Model with Non-Ideal Power Supply N. Oka, |
23Q2-3 | Analysis of Q-factor of Parallel Plate Resonance between BGA and PCB H. Kikuchi, |
23Q2-4 | Transmission and Coupling Characteristics of Transmission Lines in IC Chip Y. Kayano, |