Summary

International Symposium on Electromagnetic Compatibility

2009

Session Number:23Q2

Session:

Number:23Q2-1

Broadband Reduction of Swiching Noise by Embedding High-Density Thin-Film Capacitor in a Laminated Package

S. Kaneko,  Y. Takahashi,  T. Sudo,  A. Kanno,  

pp.579-582

Publication Date:2009/7/20

Online ISSN:2188-5079

DOI:10.34385/proc.14.23Q2-1

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Summary:
Broadband noise reduction has been investigated by embedding a high-density thin-film decoupling capacitor as much as 1 μF in a laminate package. A complex programmable logic device (CPLD) was mounted on the laminate package instead of bare chip as a noise generating circuits. Then, the package was mounted on an evaluation board. Eight output buffer circuits of the CPLD were simultaneous switched. Switching noise between the power and ground pads on the package has been dramatically reduced by the existence of high-density thin-film decoupling capacitance inside the package.