Summary
International Symposium on Electromagnetic Compatibility
2009
Session Number:23Q2
Session:
Number:23Q2-4
Transmission and Coupling Characteristics of Transmission Lines in IC Chip
Y. Kayano,
pp.591-594
Publication Date:2009/7/20
Online ISSN:2188-5079
Summary:
Establishment of signal integrity over a broad band as well as suppression of electromagnetic coupling between wirings in ICs are significant problem, because packaging density in ICs is very high. To clarify the electromagnetic compatibility (EMC) problems that related to the interconnection in the IC chip, transmission characteristics and electromagnetic coupling between wirings in the specially designed model transmission lines in IC chip were investigated by experiment and simulation. At first, model transmission lines, implemented in the bear chip with the size of 4,800 micrometers square, were designed as model parallel transmission lines. The measurement methods, usually used for transmission line in the printed circuit board, are applied to the sample IC device under test. It was demonstrated that the decrease of transmission coefficient and the dramatically large far-end cross-talk which is thought to be enough to cause serious errors arise at gigahertz frequency band.