Summary
International Symposium on Antennas and Propagation
2009
Session Number:1E2
Session:
Number:1E2-6
Study and Analysis of interconnects based on S parameter models
Sungju Choi, Liu Yang, Jaeseok Lee, Hyeongdong Kim,
pp.233-236
Publication Date:2009/10/21
Online ISSN:2188-5079
Summary:
This paper presents study and analysis of interconnects based on scattering parameter (s-parameter) models extracted by full-wave electromagnetic simulation in a CMOS process. This analysis provides well-understanding how back-end layout process affects circuit performance. The analysis of effect of interconnects is investigated in a cascode low-noise circuits for 1.84GHz to 2.5GHz. The metal line between capacitor Cex and inductor LS or the other line shows the result of effect on the full-wave simulation. This analysis will be helpful to have insight of electromagnetic coupling for more complex interconnects.