Summary

International Symposium on Electromagnetic Compatibility

2004

Session Number:3A1

Session:

Number:3A1-1

Microelectronic EMC system design for high density interconnect and high frequency environment

W. John,  

pp.481-484

Publication Date:2004/6/1

Online ISSN:2188-5079

DOI:10.34385/proc.11.3A1-1

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