Summary
International Symposium on Electromagnetic Compatibility
2009
Session Number:22R2
Session:
Number:22R2-1
An Industry-Compliant Immunity Modeling Technique for Integrated Circuits
F. Lafon, M. Ramdani, R. Perdriau, M. Drissi,
pp.357-360
Publication Date:2009/7/20
Online ISSN:2188-5079
DOI:10.34385/proc.14.22R2-1
PDF download (240.3KB)
Summary:
This paper introduces a new technique for immunity modeling of integrated circuits, compliant with industrial requirements. A specific modeling flow is introduced and validated through measurements performed on several devices. Keywords: immunity, integrated circuit, EMC model, ICIM, black-box modeling, Spice.