Summary

International Symposium on Electromagnetic Compatibility

2009

Session Number:22R2

Session:

Number:22R2-1

An Industry-Compliant Immunity Modeling Technique for Integrated Circuits

F. Lafon,  M. Ramdani,  R. Perdriau,  M. Drissi,  

pp.357-360

Publication Date:2009/7/20

Online ISSN:2188-5079

DOI:10.34385/proc.14.22R2-1

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Summary:
This paper introduces a new technique for immunity modeling of integrated circuits, compliant with industrial requirements. A specific modeling flow is introduced and validated through measurements performed on several devices. Keywords: immunity, integrated circuit, EMC model, ICIM, black-box modeling, Spice.