Summary
International Symposium on Nonlinear Theory and its Applications
2010
Session Number:P2L-A
Session:
Number:P2L-A1
Advanced PI/SI/EMI Simulation Technology for High-Speed Electronic Design - Toward chip/package/board co-design -
Hideki Asai,
pp.281-284
Publication Date:2010/9/5
Online ISSN:2188-5079
Summary:
With the progress of system integration technology, a variety of noise problems, so-called power/signal integrity and EMI issues, have become very serious in the field of chip (LSI), package and board (PCB) design. These problems cause frequently the unexpected behaviors on the today’s high-density and high-speed circuits. Thus, useful remedies are strongly demanded and the development of novel simulation technology has been expected for the short TAT (turn around time) and the cost reduction of a variety of high-performance electronic products. In this report, the historical overview and the present status of the power/signal integrity problems and electrical simulation technology in the high-speed digital era are described. Furthermore, the future trend, including 3-dimensional and full-wave simulation techniques for PI/SI/EMI design, is suggested for the total solution of chip/package/board co-design.