Electronics-Integrated Circuits and Devices(Date:1993/12/17)

Presentation
表紙

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[Date]1993/12/17
[Paper #]
目次

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[Date]1993/12/17
[Paper #]
Multichip Module Technology

Toshio Sudo,  

[Date]1993/12/17
[Paper #]ICD93-154
Si-on-Si Packaging Technology for Ultra-High-Speed Multi Processor System

Kazumichi Miyamoto,  Noboru Masuda,  Osamu Miura,  Kazunori Nakajima,  Yuuji Fujita,  Satoshi Yoshida,  Takao Mori,  Kenji Yamaguchi,  Mamoru Mita,  

[Date]1993/12/17
[Paper #]ICD93-155
RISC・CPU module

Akira Tanaka,  Hiroichi Shinohara,  Kazuji Yamada,  Toshio Hatada,  Michiharu Honda,  Yuji Shirai,  Akira Yamagiwa,  

[Date]1993/12/17
[Paper #]ICD93-156
A Development of Repair Method for W/B Multi Chip Module

Hiroaki Fujimoto,  Kenzo Hatada,  Shinji Umeda,  

[Date]1993/12/17
[Paper #]ICD93-157
Electrical Properties of 576 Leads High Density Multilayered Ceramic Quad Flat Package

Toshishige Yamamoto,  Yasuo Nakatsuka,  Masafumi Fujii,  Shizuki Hashimoto,  Nobuhiro Nishijima,  

[Date]1993/12/17
[Paper #]ICD93-158
Development of 0.3mm QFP

Hiroshi Hozoji,  Takashi Kikuchi,  Fujiaki Nose,  Teruo Kitamura,  Atsushi Honda,  Tetsuya Hayashida,  

[Date]1993/12/17
[Paper #]ICD93-159
Application of High-Pin-Count 2-Layer-Cerquad to ECL Gate-array

Toshio Hamano,  Yoshihiro Kubota,  Michio Hayakawa,  Yoshihiko Ikemoto,  Hitoshi Ohmichi,  

[Date]1993/12/17
[Paper #]ICD93-160
Wettability of tin-plated tape carrier package during thermal and humid aging

Eiichi Hosomi,  Chiaki Takubo,  Hiroshi Tazawa,  Yoichi Hiruta,  Toshio Sudo,  

[Date]1993/12/17
[Paper #]ICD93-161
Development of Plastic QFP with Small Die-Pad Configuration

Yoshinori Miyaki,  Hiromichi Suzuki,  Kunihiro Tsubosaki,  Yujiro Kajiwara,  Kazunari Suzuki,  

[Date]1993/12/17
[Paper #]ICD93-162
[OTHERS]

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[Date]1993/12/17
[Paper #]