| Presentation | 1993/12/17 Multichip Module Technology Toshio Sudo, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Multichip module technology is moving from the reseach phase for feasibility study toward the plactical application phase.MCM technology has severaltypes of substrates,such as MCM-L,MCM-C,MCM- D.Then,optimal substrate selection must be taken by taking both performance and cost into consideration.Manufacturing processof thin-film substrate,chip connection,electrical design and the rmal management is described.MCMs will be used as a RISC processor packaging.Known good die is one of essential issues for bare chip assembled MCMs for obtaining wider applications. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Multichip module / Thin-film wiring substrate / polyimide / Base die / Known good die |
| Paper # | ICD93-154 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
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| Conference Date | 1993/12/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Multichip Module Technology |
| Sub Title (in English) | |
| Keyword(1) | Multichip module |
| Keyword(2) | Thin-film wiring substrate |
| Keyword(3) | polyimide |
| Keyword(4) | Base die |
| Keyword(5) | Known good die |
| 1st Author's Name | Toshio Sudo |
| 1st Author's Affiliation | Toshiba Corp.() |
| Date | 1993/12/17 |
| Paper # | ICD93-154 |
| Volume (vol) | vol.93 |
| Number (no) | 394 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |