| Presentation | 1993/12/17 Wettability of tin-plated tape carrier package during thermal and humid aging Eiichi Hosomi, Chiaki Takubo, Hiroshi Tazawa, Yoichi Hiruta, Toshio Sudo, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | TCP(tape carrier package)is suitable for thinner and high-pin- count package.However,wettability degradation of the outer leads is getting the problem.This is caused by the thermal processes after inner lead bonding and storage atmosphere.Wettability of tin- plated TCP to Pb, Sn eutectic solder after thermal and humid aging was measured,and surface analisys was carried out by RBS(Rutherford backscattering spectroscopy)and AES(Auger electron spectroscopy).Wettability degradation of the specimens stored in dry N_2 was less than those in air.In the case that TCPs were stored in the humid conditions,their wettability degraded faster than in the dry conditions,because H_2O in the atmosphere promotes the surface oxidation. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | TAB / wettability / tin / copper / solder / diffsion |
| Paper # | ICD93-161 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1993/12/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Wettability of tin-plated tape carrier package during thermal and humid aging |
| Sub Title (in English) | |
| Keyword(1) | TAB |
| Keyword(2) | wettability |
| Keyword(3) | tin |
| Keyword(4) | copper |
| Keyword(5) | solder |
| Keyword(6) | diffsion |
| 1st Author's Name | Eiichi Hosomi |
| 1st Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation() |
| 2nd Author's Name | Chiaki Takubo |
| 2nd Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation |
| 3rd Author's Name | Hiroshi Tazawa |
| 3rd Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation |
| 4th Author's Name | Yoichi Hiruta |
| 4th Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation |
| 5th Author's Name | Toshio Sudo |
| 5th Author's Affiliation | Semiconductor Device Engineering Laboratory,Toshiba Corporation |
| Date | 1993/12/17 |
| Paper # | ICD93-161 |
| Volume (vol) | vol.93 |
| Number (no) | 394 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |