Summary
2019 Joint International Symposium on Electromagnetic Compatibility and Asia-Pacific International Symposium on Electromagnetic Compatibility, Sapporo
2019
Session Number:TuePM1B
Session:
Number:TuePM1B.4
Copper Treatment Investigation on High Frequency PCB Electrical Characteristics (I)
ShengChieh Lin, Jimmy Hsu,
pp.-
Publication Date:2016/10/5
Online ISSN:2188-5079
DOI:10.34385/proc.58.TuePM1B.4
Summary:
With the increasing of transmission speed over 10GHz in telecom industry, the design possibilities are concerned and explored to lower channel loss and enhance signal integrity. In general, insertion loss comprises the sum of conductor loss and dielectric loss. The lower loss dielectric material with the smooth copper are widely adopted in the laminated printed circuit board (PCB) to reduce the loss for high frequency application. In terms of the conductor loss, how to control the copper roughness surrounded signal trace is very important to reduce the loss when the frequency is higher. These factors that affect the surface roughness are the inherent roughness of the foil itself and the surface treatment induced roughness intended to enhance inner-layer adhesion. In this paper, a study of two copper foil types with different surface treatments in ultra low-loss material is conducted to investigate the copper treatment impact on the insertion loss up to 40 GHz. The non-etching copper treatment with the smoothest roughness showed the best electrical performance among these three surface treatment approaches.