Summary
2019 Joint International Symposium on Electromagnetic Compatibility and Asia-Pacific International Symposium on Electromagnetic Compatibility, Sapporo
2019
Session Number:TuePM1B
Session:
Number:TuePM1B.1
Study of TDR Impedance for Better Analysis to Measurement Correlation (I)
Yuandong Guo, Bichen Chen, Xinglin Sun, Xiaoning Ye, Jimmy Hsu, Jun Fan,
pp.-
Publication Date:2016/10/5
Online ISSN:2188-5079
DOI:10.34385/proc.58.TuePM1B.1
Summary:
SI engineers usually build PCB test coupons and perform cross-sectioning and material properties extraction, and then do design optimization. But designing transmission lines on PCB with good analysis to measurement correlation is really challenging. Although there are some systematic approaches which can be applied to a broad range of applications for high-speed digital designs, it is found that in the validation process, there is always several-ohm mismatch in the comparison of TDR impedance between simulated and measurement results. This degrades engineers?f confidence about high-speed design. Taking a real case as an example, this paper is trying to analyze which factors have influence on the trace impedance correlation and showing step by step how the agreement can be improved.