Summary
2019 Joint International Symposium on Electromagnetic Compatibility and Asia-Pacific International Symposium on Electromagnetic Compatibility, Sapporo
2019
Session Number:ThuPM1C
Session:
Number:ThuPM1C.3
Characterization at Logical Level of Magnetic Injection Probes
Oualid Trabelsi, Laurent Sauvage, Jean-Luc Danger,
pp.-
Publication Date:2016/10/5
Online ISSN:2188-5079
DOI:10.34385/proc.58.ThuPM1C.3
Summary:
Electromagnetic fault injection is a growing topic when it is applied to jeopardize the security of integrated circuits. Indeed, since the main part of the process is related to the properties of the near-field probes, professionals are now providing probes and benches designed for the purpose of electromagnetic injection testing. On the other hand, others are performing characterization and tend to provide information about improving the probes efficiency, as for instance its locality. In this paper, we are presenting experiments to characterize five different probes, commercial and homemade ones. The electromagnetic injection has been carried out on three different integrated circuits which appear to show different sensitivity to fault injection.