Summary
International Symposium on Electromagnetic Compatibility
2009
Session Number:22Q1
Session:
Number:22Q1-3
Improved EMC Characteristic of PCB Due to the Appropriate Via-Hole Position
L. j. Kim,
pp.285-288
Publication Date:2009/7/20
Online ISSN:2188-5079
DOI:10.34385/proc.14.22Q1-3
PDF download (273.5KB)
Summary:
That the position of the via-hole change the resonant characteristic of the microstrip line with a single via-hole is analyzed. Thus, the resonant characteristic of whole PCB may be disappeared by the appropriate choice of the position of the via-hole, and EMC performance may be improved.