Summary

International Symposium on Electromagnetic Compatibility

2009

Session Number:22Q1

Session:

Number:22Q1-3

Improved EMC Characteristic of PCB Due to the Appropriate Via-Hole Position

L. j. Kim,  

pp.285-288

Publication Date:2009/7/20

Online ISSN:2188-5079

DOI:10.34385/proc.14.22Q1-3

PDF download (273.5KB)

Summary:
That the position of the via-hole change the resonant characteristic of the microstrip line with a single via-hole is analyzed. Thus, the resonant characteristic of whole PCB may be disappeared by the appropriate choice of the position of the via-hole, and EMC performance may be improved.