Summary
International Symposium on Electromagnetic Compatibility
2014
Session Number:14P2-B
Session:
Number:14P2-B5
Design of Compact and Low-EMI Waveguide Structures based on Through Glass Vias
Xing Chang Wei, Xiao Juan Wang, De Cao Yang, Jun Li, Xin Wei,
pp.-
Publication Date:2014/05/12
Online ISSN:2188-5079
Summary:
In this paper, two kinds of compact waveguide structures based on through glass vias (TGVs) technology are proposed. A full-wave simulator on the basis of finite element method is applied to analyze the transmission characteristics of these structures. The return loss S11, transmission S21 and electric field distribution results show that they have the similar signal transmission performance to the traditional full waveguide structures. The air filled TGVs are employed in the proposed waveguides. Simulation results show that these air filled vias can concentrate electromagnetic field within the waveguides, and hence reduce the electromagnetic interference.