Summary
International Symposium on Electromagnetic Compatibility
2014
Session Number:14P2-B
Session:
Number:14P2-B1
In-Stack Monitoring of Signal and Power Nodes in Three Dimensional Integrated Circuits
Yuuki Araga, Ranto Miura, Nao Ueda, Noriyuki Miura, Makoto Nagata,
pp.-
Publication Date:2014/05/12
Online ISSN:2188-5079
Summary:
An on-chip waveform monitoring technique embodies in-stack evaluation of three-dimensional integrated circuits (3D IC) regarding physical connections using through silicon vias (TSV) and electronic characteristics of signal transmission as well as noise propagation. On-chip generation of reference voltage steps and sampling timings reduces the complexity of analog signal routing in a chip stack and enhances measurement throughputs. The demonstrated 7.6 effective bit resolution with a 5.8 times higher throughput is suitable for in-stack monitoring. Sinusoidal signal transmission in a two-tier 3D IC is on-chip evaluated.