Optoelectronic Package using Optical Waveguide Hole for Chip-to-chip interconnection

Takeshi Ohno; Yutaka Takagi; Toshikazu Horio; Toshifumi Kojima; Toshikatsu Takada; Kazushige Obayashi; Masahiko Okuyama

Summary

Optoelectronics and Communications Conference/International Conference on Integrated Optics and Optical Fiber Communication

2007

Session Number:11D2

Session:

Number:11D2-5

Optoelectronic Package using Optical Waveguide Hole for Chip-to-chip interconnection

Takeshi Ohno, Yutaka Takagi, Toshikazu Horio, Toshifumi Kojima, Toshikatsu Takada, Kazushige Obayashi, Masahiko Okuyama,

pp.186-187

Publication Date:2007/7/9

Online ISSN:2188-5079

DOI:10.34385/proc.49.11D2-5

PDF download (387.4KB)

Summary:

We have proposed an optoelectronic package structure having optical waveguide holes through a package for chip-to-chip interconnections. This can be coupled optical device to a fiber array by passive alignment from LSI mounting plane.