Summary
International Technical Conference on Circuits/Systems, Computers and Communications
2008
Session Number:P2
Session:
Number:P2-108
Integration of RF Passive Components into Semiconducting Device Through 3D Capacitive Coupling for Application to Fully-Integrated MMIC
Young Yun, Han-Nah Joh, Young-Bae Park, Se-Ho Kim,
pp.-
Publication Date:2008/7/7
Online ISSN:2188-5079
Summary:
In this work, a 3D capacitive coupling structure employing periodic pattern was used for application to miniaturized on-chip passive components on MMIC (Monolithic Microwave Integrated Circuit). Unlike conventional periodic structure, the characteristic impedance of the 3D capacitive coupling structure was hardly dependent on frequency. Using the 3D capacitive coupling structure, RF passive component was highly miniaturized in comparison with conventional one.