Summary
International Technical Conference on Circuits/Systems, Computers and Communications
2008
Session Number:E7
Session:
Number:E7-2
Miniaturized Active Balun MMIC Employing Active Device
Young-Bae Park, Se-Ho Kim, Han-Nah Joh, Young Yun, Kyu-Ho Park, Kwang-Ho Ahn,
pp.-
Publication Date:2008/7/7
Online ISSN:2188-5079
Summary:
In this paper, miniaturized active baluns employing active device were proposed. The miniaturized active baluns were fabricated employing InGaP/GaAs HBT (heterojunction bipolar transistor) on GaAs substrate for MMIC applications, and especially a composite structure employing common-emitter (CE) and common-collector (CC) circuits was used for 90° power coupling. The size of the active balun for power coupling was about 1.9 % of conventional passive branch-line coupler. The active baluns for power coupling showed good RF performances comparable to passive branch-line couplers.