Summary
International Technical Conference on Circuits/Systems, Computers and Communications
2008
Session Number:E1
Session:
Number:E1-3
Fault Analysis of Interconnect Opens in 90nm CMOS ICs with Device Simulator
Masaki Hashizume, Yuichi Yamada, Hiroyuki Yotsuyanagi, Toshiyuki Tsutsumi, Koji Yamazaki, Yoshinobu Higami, Hiroshi Takahashi, Yuzo Takamatsu,
pp.-
Publication Date:2008/7/7
Online ISSN:2188-5079
DOI:10.34385/proc.39.E1-3
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Summary:
Faulty effects of interconnect opens in logic ICs fabricated with a 90nm CMOS process are analyzed by device simulation. Also, it is examined whether a logical error can be caused at an opened input signal line by logic signals of the neighboring signal lines. The simulation results suggest us that a logical error may occur at an interconnect surrounding by 8 interconnects if the interconnects are longer than 5μm and the width of an open defect is greater than 2.0nm.