Electronics-Silicon Devices and Materials(Date:1997/01/24)

Presentation
表紙

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[Date]1997/1/24
[Paper #]
目次

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[Date]1997/1/24
[Paper #]
A Novel TiN/Ti Contact Plug Technology for Gigabit Scale DRAM using Ti-PECVD and TiN-LPCVD

K Ohto,  K Urabe,  T Taguwa,  S Chikaki,  T Kikkawa,  

[Date]1997/1/24
[Paper #]SDM96-206
Application of CVD-TiN/Ti barrier layer for contact plug processes

Kenichi Mori,  Kazuyoshi Maekawa,  Yukinori Hirose,  Akihiko Ohsaiki,  Yohji Mashiko,  Makoto Hirayama,  

[Date]1997/1/24
[Paper #]SDM96-207
Polysilicon-Aluminum Substitute(PAS) Technique for Subquartermicron Logic/DRAM LSIs

Hiroshi Horie,  Masahiko Imai,  Akio Itoh,  Yoshihiro Arimoto,  

[Date]1997/1/24
[Paper #]SDM96-208
Effects of Insulator Surface Roughness on Al Preferred Orientation in Al-alloy/Ti Structure

Tadashi Narita,  Kenshin Touchi,  Keiichi Hashimoto,  Hiroshi Onoda,  

[Date]1997/1/24
[Paper #]SDM96-209
Process Technology for Chemical Vapor Deposition of Copper

Nobuyoshi Awaya,  

[Date]1997/1/24
[Paper #]SDM96-210
High Reliable Cu-Mg Alloy Interconnect Technology

R Kaihara,  T Takewaki,  T Ohmi,  T Nitta,  

[Date]1997/1/24
[Paper #]SDM96-211
A New Cobalt Salicide Technology for 0.15μm CMOS Device

Ken Inoue,  Kaoru Mikagi,  Hitoshi Abiko,  Takamaro Kikkawa,  

[Date]1997/1/24
[Paper #]SDM96-212
Formation of Low k Dielectric Interlayer with Si-CH_3 Bonds

Hitoshi Itoh,  Akiko Nara,  

[Date]1997/1/24
[Paper #]SDM96-213
IMPROVEMENT OF SOG GAP-FILLING AND PLANARIZATION THROUGH THE CONTROL OF ORGANIC COMPONENTS

M Saito,  M Hirasawa,  K Kato,  N Kobayashi,  A Takamatsu,  

[Date]1997/1/24
[Paper #]SDM96-214
Application of Ion-Implanted Organic SOG to the CMP Process

Yoshio Okayama,  Yasunori Inoue,  Hideki Mizuhara,  Shin-ichi Tanimoto,  Kazutoshi Tsujimura,  Hiroyuki Watanabe,  Hiroshi Hanafusa,  Keiichi Yodoshi,  

[Date]1997/1/24
[Paper #]SDM96-215
CMP Technology for Superior Uniformity Performance : Development of Air-Backed Carrier and Pad-Press Ring

M Nishio,  T Murakami,  M Satake,  S Mayumi,  

[Date]1997/1/24
[Paper #]SDM96-216
[OTHERS]

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[Date]1997/1/24
[Paper #]