Presentation 1997/1/24
A New Cobalt Salicide Technology for 0.15μm CMOS Device
Ken Inoue, Kaoru Mikagi, Hitoshi Abiko, Takamaro Kikkawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) A new cobalt salicide technology using high-temperature sputtering and in-situ vacuum annealing has been developed. Sputtering at an elevated temperature and annealing without a break of vacuum were shown to promote in-situ silicidation and hence, suppress oxidation of the Co film. By using this technology, no linewidth dependence was observed for the sheet resistance down to 0.15μm wide gate electrode. The high temperature sputtering process was also observed to lead to the growth of epitaxial CoSi_2 thin films during subsequent anneals. A significant improvement in thermal stability was observed process and was attributed to the stability of the epitaxial silicide interfaces. When Co high temperature sputtering was performed, a very uniform and directional grain of CoSi_x can be formed. Consequently, epitaxial CoSi_2 is grown.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) CoSi_2 / salicide / high-temperature sputtering / in-situ vacuum annealing / epitaxial growth / growth / thermal stability
Paper # SDM96-212
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Conference Information
Committee SDM
Conference Date 1997/1/24(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A New Cobalt Salicide Technology for 0.15μm CMOS Device
Sub Title (in English)
Keyword(1) CoSi_2
Keyword(2) salicide
Keyword(3) high-temperature sputtering
Keyword(4) in-situ vacuum annealing
Keyword(5) epitaxial growth
Keyword(6) growth
Keyword(7) thermal stability
1st Author's Name Ken Inoue
1st Author's Affiliation ULSI Device Development Laboratories, NEC Corporation()
2nd Author's Name Kaoru Mikagi
2nd Author's Affiliation ULSI Device Development Laboratories, NEC Corporation
3rd Author's Name Hitoshi Abiko
3rd Author's Affiliation ULSI Device Development Laboratories, NEC Corporation
4th Author's Name Takamaro Kikkawa
4th Author's Affiliation ULSI Device Development Laboratories, NEC Corporation
Date 1997/1/24
Paper # SDM96-212
Volume (vol) vol.96
Number (no) 498
Page pp.pp.-
#Pages 7
Date of Issue