Presentation 1997/1/24
A Novel TiN/Ti Contact Plug Technology for Gigabit Scale DRAM using Ti-PECVD and TiN-LPCVD
K Ohto, K Urabe, T Taguwa, S Chikaki, T Kikkawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) A new TiN/Ti contact plug technology for Gigabit-scale DRAM was developed by use of Ti plasma-enhanced chemical vapor deposition (PECVD) and TiN low-pressure chemical vapor deposition (LPCVD). When PECVD-Ti film was deposited at greater than 545℃, in-situ Ti silicidation occurred on Si. The step coverage of LPCVD-TiN film was 100% in fine contact up to the aspect ratio of 7. By using this technology, low contact resistances and junction leakage currents were obtained for 0.25 μm contact holes with aspect ratio of 6.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Ti / TiSi_2 / TiN / CVD / Contact / DRAM
Paper # SDM96-206
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Committee SDM
Conference Date 1997/1/24(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Novel TiN/Ti Contact Plug Technology for Gigabit Scale DRAM using Ti-PECVD and TiN-LPCVD
Sub Title (in English)
Keyword(1) Ti
Keyword(2) TiSi_2
Keyword(3) TiN
Keyword(4) CVD
Keyword(5) Contact
Keyword(6) DRAM
1st Author's Name K Ohto
1st Author's Affiliation ULSI Device Development Laboratories, NEC Corporation()
2nd Author's Name K Urabe
2nd Author's Affiliation ULSI Device Development Laboratories, NEC Corporation
3rd Author's Name T Taguwa
3rd Author's Affiliation ULSI Device Development Laboratories, NEC Corporation
4th Author's Name S Chikaki
4th Author's Affiliation ULSI Device Development Laboratories, NEC Corporation
5th Author's Name T Kikkawa
5th Author's Affiliation ULSI Device Development Laboratories, NEC Corporation
Date 1997/1/24
Paper # SDM96-206
Volume (vol) vol.96
Number (no) 498
Page pp.pp.-
#Pages 7
Date of Issue