Electronics-Component Parts and Materials(Date:1995/10/20)

Presentation
表紙

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[Date]1995/10/20
[Paper #]
目次

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[Date]1995/10/20
[Paper #]
Cu/Benzocyclobutene Thin-Film Multilayer Technology

Tadanori SHIMOTO,  Koji MATSUI,  Yuzo SHIMADA,  Kauzuaki UTSUMI,  

[Date]1995/10/20
[Paper #]CPM95-77
Build-up Wiring Board using Via Post Interconnection

Yoshiro Takahashi,  Yutaka Uno,  Kei Nakakuki,  Yasuo Iguchi,  Satoshi Itaya,  

[Date]1995/10/20
[Paper #]CPM95-78
A New Type ML-PWB made aramid for future CSP and MCM-L application

masayuki Okano,  Seiichi Nakatani,  Shinji Nakamura,  Akira Wada,  

[Date]1995/10/20
[Paper #]CPM95-79
Tick film metallizaition technique for Aluminium Nitride

Masuhiro Natsuhara,  Hirohiko Nakata,  

[Date]1995/10/20
[Paper #]CPM95-80
Interface of Sn-Ag lead-free solder and Cu ; Strengh and microstrtlcture of Sn-Ag/Cu interface

Hirofumi Nakase,  Kastuaki Suganumna,  Yoshikazu Nakamura,  

[Date]1995/10/20
[Paper #]CPM95-81
High density modules using bump interconnection for mobile communication

Takasi Togasaki,  Miki Mori,  Tatsuro Uchida,  Yuji Iseki,  Masayuki Saito,  

[Date]1995/10/20
[Paper #]CPM95-82
IC Package for Anti- EMI Prevetion

Yoshihiro Hosoya,  Hidenori Egawa,  Moriyama Yoshifumi,  Yoshihiro Hirota,  Keiji Masui,  

[Date]1995/10/20
[Paper #]CPM95-83
[OTHERS]

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[Date]1995/10/20
[Paper #]