| Presentation | 1995/10/20 A New Type ML-PWB made aramid for future CSP and MCM-L application masayuki Okano, Seiichi Nakatani, Shinji Nakamura, Akira Wada, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Conventional multi-layer printed wiring board (ML-PWB) with drilled and plated through-holes has not been able to satisfy the requirement of down-sizing. To meet this requirement, we have developed a new type ML-PWB "ALIVH" (Any Layer Inner Via Hole ML-PWB). ALIVH made of nonwoven aramid has low thermal expansion coefficient (6 to 8ppm/℃). The structure of ALIVH enables us to make electrical interconnection between any two layers of the laminate, and offers benefit of shorter wiring length. Therefore, ALIVH has a great potential to cope with flip chip bonding technology for CSP and MCM-L applications. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | ML-PWB / Nonwoven aramid / CSP / MCM-L / IVH / Themal expansion |
| Paper # | CPM95-79 |
| Date of Issue |
| Conference Information | |
| Committee | CPM |
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| Conference Date | 1995/10/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A New Type ML-PWB made aramid for future CSP and MCM-L application |
| Sub Title (in English) | |
| Keyword(1) | ML-PWB |
| Keyword(2) | Nonwoven aramid |
| Keyword(3) | CSP |
| Keyword(4) | MCM-L |
| Keyword(5) | IVH |
| Keyword(6) | Themal expansion |
| 1st Author's Name | masayuki Okano |
| 1st Author's Affiliation | Matushita Electric Components co., Ltd printed Circuit Board Division() |
| 2nd Author's Name | Seiichi Nakatani |
| 2nd Author's Affiliation | Matushita Electric Industry Co., Ltd Device Engineering Development Center |
| 3rd Author's Name | Shinji Nakamura |
| 3rd Author's Affiliation | Matushita Electric Components co., Ltd printed Circuit Board Division |
| 4th Author's Name | Akira Wada |
| 4th Author's Affiliation | Matushita Electric Components co., Ltd printed Circuit Board Division |
| Date | 1995/10/20 |
| Paper # | CPM95-79 |
| Volume (vol) | vol.95 |
| Number (no) | 332 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |