| Presentation | 1995/10/20 Cu/Benzocyclobutene Thin-Film Multilayer Technology Tadanori SHIMOTO, Koji MATSUI, Yuzo SHIMADA, Kauzuaki UTSUMI, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This paper describes a Cu/Bmenzocyclobutene (BCB) thin-film multilayer technology which enables reliable fabrication of high-performance and low cost applications. The technology has the advantages of Cu conductor with no adhesion/barrier metal layer, excellent planarization, and low processing temperature. A prototype module fabricated with the technology passed all the long-term reliability test that is required for real operation . |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Benzocyclobutene / Photosensitive / Cu Conductor / Multilayer / MCM / MCM-D |
| Paper # | CPM95-77 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 1995/10/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Cu/Benzocyclobutene Thin-Film Multilayer Technology |
| Sub Title (in English) | |
| Keyword(1) | Benzocyclobutene |
| Keyword(2) | Photosensitive |
| Keyword(3) | Cu Conductor |
| Keyword(4) | Multilayer |
| Keyword(5) | MCM |
| Keyword(6) | MCM-D |
| 1st Author's Name | Tadanori SHIMOTO |
| 1st Author's Affiliation | Material Development Center, NEC Corporation() |
| 2nd Author's Name | Koji MATSUI |
| 2nd Author's Affiliation | Material Development Center, NEC Corporation |
| 3rd Author's Name | Yuzo SHIMADA |
| 3rd Author's Affiliation | Material Development Center, NEC Corporation |
| 4th Author's Name | Kauzuaki UTSUMI |
| 4th Author's Affiliation | Material Development Center, NEC Corporation |
| Date | 1995/10/20 |
| Paper # | CPM95-77 |
| Volume (vol) | vol.95 |
| Number (no) | 332 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |