Presentation | 1995/10/20 Tick film metallizaition technique for Aluminium Nitride Masuhiro Natsuhara, Hirohiko Nakata, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | As semiconductor device grow in size and power consumption thermal stress and heat dissipation are becoming serious probrems. Aluminium nitride, with its low thermal expansion ratio and high thermal conductivity, is attracting attention as a possible solution to these problems, and practical applications are being studied. Meanwhile, as semiconductor integration density increases, so does substrate wiring density. Though expensive, thin-film metallization has been the only solutoin to the problem of high-density wiring. Now, however, new soldering and printing techniques allow thick-film technology to be applied to fine patterns with line widths and line spacing as low as 75μm. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | aluminium nitride / thich film matallization / high thermal conductivity / fine pattern / printing techniques / low thermal expansion ratio |
Paper # | CPM95-80 |
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Conference Information | |
Committee | CPM |
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Conference Date | 1995/10/20(1days) |
Place (in Japanese) | (See Japanese page) |
Place (in English) | |
Topics (in Japanese) | (See Japanese page) |
Topics (in English) | |
Chair | |
Vice Chair | |
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Assistant |
Paper Information | |
Registration To | Component Parts and Materials (CPM) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Tick film metallizaition technique for Aluminium Nitride |
Sub Title (in English) | |
Keyword(1) | aluminium nitride |
Keyword(2) | thich film matallization |
Keyword(3) | high thermal conductivity |
Keyword(4) | fine pattern |
Keyword(5) | printing techniques |
Keyword(6) | low thermal expansion ratio |
1st Author's Name | Masuhiro Natsuhara |
1st Author's Affiliation | Sumitomo Electric Industries LTD() |
2nd Author's Name | Hirohiko Nakata |
2nd Author's Affiliation | Sumitomo Electric Industries LTD |
Date | 1995/10/20 |
Paper # | CPM95-80 |
Volume (vol) | vol.95 |
Number (no) | 332 |
Page | pp.pp.- |
#Pages | 5 |
Date of Issue |