PROGRAM
Keynote
- STT-MRAM and MTJ/CMOS hybrid NV-application processor for IoT and AI era
- Tetsuo Endoh (Tohoku Univ.)
- Towards topological quantum bits
- Koji Ishibashi (RIKEN)
- Si highly resistive substrate (HRS) based RF process and devices for mobile front end applications
- Yoon Jong Lee (DB Hitek)
Invite
- A numerical investigation of delta-doped β-(AlxGa1-x)2O3/β-Ga2O3 double channel heterostructure MODFETs
- Gokhan Atmaca (Hongik University)
- Phase formation of ferroelectric HfO2 films
- Hiroshi Funakubo (Tokyo Institute of Technology)
- Charge-balanced GaN super-heterojunction Schottky barrier diode: Design and experimental demonstration
- Sangwoo Han (Penn State Univ.)
- Compact model for reconfigurable field-effect transistors
- Sungyeop Jung (Advanced Institute of Convergence Technology)
- GaN-based light-emitting diode with hole distribution layer for high efficiency and color tunability
- Garam Kim (Myongji Univ.)
- Monolithic 3D for high frequency mixed signal IC
- Sanghyeon Kim (KAIST)
- Low power artificial neuron circuits using steep switching devices
- Min-woo Kwon (Gangneung-Wonju National Univ.)
- GaN HEMT technology for low-loss and high-voltage applications
- Masaaki Kuzuhara (Kwansei Gakuin Univ.)
- Investigation of HfSiOx gate insulator formed by changing fabrication process conditions for GaN power device
- Toshihide Nabatame (NIMS)
- Reaction mechanism of area-selective atomic layer deposition for advanced device fabrication
- Il-kwon Oh (Ajou Univ.)
- Information processing nanodevices learning from natural system
- Takahide Oya (Yokohama National Univ.)
- The role of photon to electron converted organic materials for image sensor
- Kyung-Bae Park (Samsung Advanced Institute of Technology)
- Application of electromigrated Au nanogaps to artificial synaptic devices and physical reservoir computing
- Keita Sakai (Tokyo Univ. of Agriculture and Technology)
- Ultra-thin and lightweight organic amplifier enabling bio-signal monitoring with reduced noise levels
- Tsuyoshi Sekitani (Osaka Univ.)
- Polymer packaging for high frequency and implantable devices
- Seonho Seok (CNRS-University Paris Saclay)
- Quantum chemical understanding of atomic layer deposition process
- Bonggeun Shong (Hongik University)
- Phase change materials enabling low-energy PCRAM
- Yuji Sutou (Tohoku Univ.)
- SiC MOSFET - key device for future electrification
- Tomohide Terashima (Mitsubishi Electric Corp.)
- Present status and prospect of graphene interconnect application
- Kazuyoshi Ueno (Shibaura Institute of Technology)
- Approaches of highly reliable package for high power electronic devices
- Sang Won Yoon (Hanyang Univ.)