Electronics-Silicon Devices and Materials(Date:2024/02/21)

Presentation
[Invited Talk] Optimization of Pre-Bonding Surface for Cu/SiCN Hybrid Bonding

Kohei Nakayama(YNU),  Kenta Hayama(YNU),  Yutesu Kamiya(YNU),  Fmihiro Inoue(YNU),  

[Date]2024-02-21
[Paper #]SDM2023-85
[Invited Talk] Development of Superconducting Nb Interconnects for Low-Temperature SoC for Qubit Control

Hideaki Numata(NBS),  Noriyuki Iguchi(NBS),  Masamitsu Tanaka(Nagoya Univ.),  Koichiro Okamoto(NBS),  Sadahiko Miura(NBS),  Ken Uchida(UTokyo),  Hiroki Ishikuro(Keio Univ.),  Toshitsugu Sakamoto(NBS),  Munehiro Tada(NBS),  

[Date]2024-02-21
[Paper #]SDM2023-82
[Invited Talk] Metallization and CMOS Directly Bonded to Array (CBA) Technology for 3D Flash Memory

Masayoshi Tagami(KIOXIA),  

[Date]2024-02-21
[Paper #]SDM2023-86
[Invited Talk] Recent Studies of WoW and CoW Cu-Cu Hybrid Bonding

Yoshihisa Kagawa(SSS),  Yukako Ikegami(SSS),  Takahiro Kamei(SSS),  Hayato Iwamoto(SSS),  

[Date]2024-02-21
[Paper #]SDM2023-87
[Invited Talk] Direct observation of local electromagnetic field distribution in materials and devices

Naoya Shibata(UTokyo),  

[Date]2024-02-21
[Paper #]SDM2023-84
[Invited Talk] Development of Backside Buried Metal Layer Technology to Enhance Power Integrity of Three-Dimensional Integrated Circuits

Naoya Watanabe(AIST),  Yuuki Araga(AIST),  Haruo Shimamoto(AIST),  Makoto Nagata(Kobe Univ.),  Katsuya Kikuchi(AIST),  

[Date]2024-02-21
[Paper #]SDM2023-83
[Invited Talk] Pre-treatment Study for Barrier-less Ruthenium Filling into Single Damascene via of Sub 20nm Hole Size

Ryota Yonezawa(TTCA),  Kai-Hung Yu(TTCA),  Hirokazu Aizawa(TTCA),  Hidenao Suzuki(TTCA),  Cory Wajda(TTCA),  Gert Leusink(TTCA),  

[Date]2024-02-21
[Paper #]SDM2023-81