Electronics-Silicon Devices and Materials(Date:2012/02/27)

Presentation
表紙

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[Date]2012/2/27
[Paper #]
目次

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[Date]2012/2/27
[Paper #]
Development of Ultra-low Voltage Devices utilizing BEOL Process

Shin'ichiro Kimura,  

[Date]2012/2/27
[Paper #]SDM2011-176
Basic Performance of a Logic-IP Compatible eDRAM with Cylinder Capacitors in Low-k/Cu BEOL Layers

Ippei Kume,  Naoya Inoue,  Ken'ichiro Hijioka,  Jun Kawahara,  Kouichi Takeda,  Naoya Furutake,  Hiroki Shirai,  Kenya Kazama,  Sin'ichi Kuwabara,  Masatoshi Watarai,  Takashi Sakoh,  Takafumi Takahashi,  Takashi Ogura,  Toshiji Taiji,  Yoshiko Kasama,  Misato Sakamoto,  Masami Hane,  Yoshihiro Hayashi,  

[Date]2012/2/27
[Paper #]SDM2011-177
InGaZnOのチャネルの酸素制御とGate/Drain Offset構造によるBEOLトランジスタの高信頼化(配線・実装技術と関連材料技術)

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[Date]2012/2/27
[Paper #]SDM2011-178
Initial Growth Observation of Multilayer Graphene on SiO_2/Si substrates Using Raman Spectroscopy and XPS

Yoshihiro OJIRO,  Shuichi OGAWA,  Manabu INUKAI,  Motonobu SATO,  Eiji IKENAGA,  Takayuki MURO,  Mizuhisa NIHEI,  Yuji TAKAKUWA,  Naoki YOKOYAMA,  

[Date]2012/2/27
[Paper #]SDM2011-179
Single-layered barrier/liner Co(W) by ALD/CVD for next generation ULSI-Cu interconnect

Hideharu SHIMIZU,  Kohei SHIMA,  Takeshi MOMOSE,  Yoshihiko KOBAYASHI,  Yukihiro SHIMOGAKI,  

[Date]2012/2/27
[Paper #]SDM2011-180
Evaluation of additives effects in copper electroplating solution by rapid exchange using microfluidic reactor

Takeyasu Saito,  Yutaka Miyamoto,  Sunao Hattori,  Naoki Okamoto,  Kazuo Kondo,  

[Date]2012/2/27
[Paper #]SDM2011-181
Formation of conformal barrier layer by electroless plating for TSV of 3D-LSI

Ryohei ARIMA,  Hiroshi MIYAKE,  Fumihiro Inoue,  Tomohiro Shimizu,  Shoso Shingubara,  

[Date]2012/2/27
[Paper #]SDM2011-182
Influence of Via Stress on Surface Micro-roughness-induced Leakage Current in Through-Silicon Via Interconnects

Hideki KITADA,  Nobuhide MAEDA,  Koji FUJIMOTO,  Shoichi KODAMA,  Youngsuk KIM,  Yoriko MIZUSHIMA,  Tomoji NAKAMURA,  Takayuki OHBA,  Yoshihiro NAKATA,  

[Date]2012/2/27
[Paper #]SDM2011-183
Characterization of Local Strain around Through Silicon Via Interconnect in Wafer-on-wafer Structures

Osamu NAKATSUKA,  Hideki KITADA,  Young Suk KIM,  Yoriko MIZUSHIMA,  Tomoji NAKAMURA,  Takayuki OHBA,  Shigeaki ZAIMA,  

[Date]2012/2/27
[Paper #]SDM2011-184
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[Date]2012/2/27
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[Date]2012/2/27
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[Date]2012/2/27
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[Date]2012/2/27
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