Electronics-Integrated Circuits and Devices(Date:1998/12/11)

Presentation
表紙

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[Date]1998/12/11
[Paper #]
目次

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[Date]1998/12/11
[Paper #]
Technology for module design with the source synchronous bus for the high energy heavy ion physics

H. Hara,  Y. Tanaka,  K. Ebisu,  H. Hamagaki,  K. Oyama,  M. Hibino,  T. Matsumoto,  

[Date]1998/12/11
[Paper #]CPM98-158,ICD98-237
Bondability of 100kHz thermosonic wire bonding

Taizo TOMIOKA,  Tomohiro IGUCHI,  Ikuo MORI,  Kazumi OHTANI,  Mutsumi SUEMATSU,  Koichiro ATSUMI,  

[Date]1998/12/11
[Paper #]CPM98-159,ICD98-238
The Application of Bare LSI Chip Mounting Technology to the Mobile Communications Terminals

Minoru Takizawa,  Akiko Torii,  Mitsutoshi Sawano,  

[Date]1998/12/11
[Paper #]CPM98-160,ICD98-239
Evaluation of Structural Integrity in Plastic Encapsulated Semiconductor Package during Soldering Process

Noriyasu KAWAMURA,  Kenji HIROHATA,  Takashi KAWAKAMI,  Kanako SAWADA,  Toshikazu MINO,  Atsushi KUROSU,  Hideko MUKAIDA,  

[Date]1998/12/11
[Paper #]CPM98-161,ICD98-240
Lead(Pb)Free Thick Film Resistor Paste

Masashi Fukaya,  

[Date]1998/12/11
[Paper #]CPM98-162,ICD98-241
Small CTE Marerial using COPNA Resin

Kazunari Nawa,  

[Date]1998/12/11
[Paper #]CPM98-163,ICD98-242
A method for At-speed testing with over 250MHz Hi-speed DRAM

Hiroyuki Noji,  Natsuki Kushiyama,  

[Date]1998/12/11
[Paper #]CPM98-164,ICD98-243
Universal Test Interface for embedded DRAM testing

Ryo Fukuda,  Shinji Miyano,  Katsuhiko Sato,  Kenji Numata,  

[Date]1998/12/11
[Paper #]CPM98-165,ICD98-244
FBGA/CSP flexible assembly lines with whole-cavity molding method

Satoshi Takabayashi,  Masato Aiba,  Yasuhiro Suzuki,  Yoshihiro Matsuura,  

[Date]1998/12/11
[Paper #]CPM98-166,ICD98-245
High Reliability, High Density, Low Cost Packaging Systems for Matrix BGA and CSP by VPES(Vacuum Printing Encapsulation Systems)

Atsushi Okuno,  

[Date]1998/12/11
[Paper #]CPM98-167,ICD98-246
Micro-ball Bump for Flip Interconnections

Kenji Shimokawa,  Eiji Hashino,  Yoshio Ohzeki,  Kohei Tatsumi,  

[Date]1998/12/11
[Paper #]CPM98-168,ICD98-247
Thermally Enhanced Flip-chip BGA with Organic Substrate

Hironori Matsushima,  Qiang Wu,  Masaki Watanabe,  Eiji Hayashi,  Yoshihiro Tomita,  Shinji Baba,  Yoshitaka Takemoto,  Yasumi Uegai,  

[Date]1998/12/11
[Paper #]CPM98-169,ICD98-248
A Novel Flip Chip Packaging Process and The Reliability Using Non Conductive Resin Film

Satoshi Ito,  Masaki Mizutani,  Hiroshi Noro,  Makoto Kuwamura,  

[Date]1998/12/11
[Paper #]CPM98-170,ICD98-249
[OTHERS]

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[Date]1998/12/11
[Paper #]