| Presentation | 1998/12/11 Micro-ball Bump for Flip Interconnections Kenji Shimokawa, Eiji Hashino, Yoshio Ohzeki, Kohei Tatsumi, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Micro-ball bump technology has been developed for flip chip interconnection. This technology is based on(1)a production method of fine metal balls(maicro-balls)and(2)a gangbonding method for forming bumps(micro-ball bumps)on chip electrodes. Solder balls of 60-150μm and gold balls of 35-100μm in diameter were prepared with extremely uniform diameters and high sphericity. After holding these micro-balls on through-holes of an arrangement plate, the micro-balls were transferred onto the electrodes of the chips in order to form the micro-ball bumps. The cycle time of the originally developed mounter was 20seconds. The micro-solder bumps were formed onto the electrodes covered with under bump metal. The micro-solder bumps were uniform in composition, volume, and height because of the use of the micro-solder-balls with precisely controlled diameter and composition. Using the micro-gold-balls, the bumps with 50μm pitch were formed on Al pads by means of thermocompression bonding. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | flip chip / micro-ball bump / solder / gold |
| Paper # | CPM98-168,ICD98-247 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 1998/12/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Micro-ball Bump for Flip Interconnections |
| Sub Title (in English) | |
| Keyword(1) | flip chip |
| Keyword(2) | micro-ball bump |
| Keyword(3) | solder |
| Keyword(4) | gold |
| 1st Author's Name | Kenji Shimokawa |
| 1st Author's Affiliation | Nippon Steel Corporation Advanced Technology Research Laboratories() |
| 2nd Author's Name | Eiji Hashino |
| 2nd Author's Affiliation | Nippon Steel Corporation Advanced Technology Research Laboratories |
| 3rd Author's Name | Yoshio Ohzeki |
| 3rd Author's Affiliation | Nippon Steel Corporation Advanced Technology Research Laboratories |
| 4th Author's Name | Kohei Tatsumi |
| 4th Author's Affiliation | Nippon Steel Corporation Advanced Technology Research Laboratories |
| Date | 1998/12/11 |
| Paper # | CPM98-168,ICD98-247 |
| Volume (vol) | vol.98 |
| Number (no) | 459 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |