| Presentation | 1998/12/11 Evaluation of Structural Integrity in Plastic Encapsulated Semiconductor Package during Soldering Process Noriyasu KAWAMURA, Kenji HIROHATA, Takashi KAWAKAMI, Kanako SAWADA, Toshikazu MINO, Atsushi KUROSU, Hideko MUKAIDA, |
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| PDF Download Page | PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Plastic encapsulated semiconductor package may crack if an internal delamination is induced during the reflow soldering process. Evaluation of structural Integrity in the packages is becoming increasingly important. Firstly, three-dimensional stress analyses were carried out to obtain stress distributions in the package during the soldering process. Secondly, the adhesion integrity between chip backside and resin was predicted by comparing the analytical results for the package and the stress distribution calculated from adhesion strength test results. Next, integrity of resin edge structure was estimated using criterion calculated from fracture toughness and bending strength for resin. Finally, the new evalution method was confirmed to be effective by comparison with package reliability tests. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Stress analysis / Strength test / Fracture criterion / Plastic package / Reflow cracking |
| Paper # | CPM98-161,ICD98-240 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
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| Conference Date | 1998/12/11(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Evaluation of Structural Integrity in Plastic Encapsulated Semiconductor Package during Soldering Process |
| Sub Title (in English) | |
| Keyword(1) | Stress analysis |
| Keyword(2) | Strength test |
| Keyword(3) | Fracture criterion |
| Keyword(4) | Plastic package |
| Keyword(5) | Reflow cracking |
| 1st Author's Name | Noriyasu KAWAMURA |
| 1st Author's Affiliation | Research and Development Center, Toshiba Corporation() |
| 2nd Author's Name | Kenji HIROHATA |
| 2nd Author's Affiliation | Research and Development Center, Toshiba Corporation |
| 3rd Author's Name | Takashi KAWAKAMI |
| 3rd Author's Affiliation | Research and Development Center, Toshiba Corporation |
| 4th Author's Name | Kanako SAWADA |
| 4th Author's Affiliation | Semiconductor Manufacturing Engineering Center, Toshiba Corporation |
| 5th Author's Name | Toshikazu MINO |
| 5th Author's Affiliation | Semiconductor Manufacturing Engineering Center, Toshiba Corporation |
| 6th Author's Name | Atsushi KUROSU |
| 6th Author's Affiliation | Semiconductor Manufacturing Engineering Center, Toshiba Corporation |
| 7th Author's Name | Hideko MUKAIDA |
| 7th Author's Affiliation | Semiconductor Manufacturing Engineering Center, Toshiba Corporation |
| Date | 1998/12/11 |
| Paper # | CPM98-161,ICD98-240 |
| Volume (vol) | vol.98 |
| Number (no) | 459 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |